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Your Location:Home > Thiourea used in electroplating additives

   Thiourea sulfur atom in the molecule ligand effects, metal ions in the solution can block discharge, the adsorption layer is formed on the surface of the solution interface is blocked, thereby increasing cathodic polarization, the coating can be refined crystal structure, to achieve smooth, bright, meticulous coating purposes. Kun et Raymond thiourea in the bath that partial hydrolysis, the resulting sol molecules are selectively adsorbed MeS central portion in the active electrode, whereby light from the leveling effect of the coating.

    Thiourea has been widely used as an additive in the field of electro-galvanized, in particular zinc chloride system. Wang Xin and other pre-plating with thiourea as an additive greatly improved coatings on iron matrix adhesion. Lukomska A, etc., Famdon EE research group, Fabriciuse group 'Suarez DF 351 and the like by adding a small amount of thiourea in copper plating solution, it can make copper plating planarity, smooth and corrosion resistance is greatly improved. The appearance and characteristics of M Alodan research team bath thiourea is how it affects copper plating made a lot of research work, a similar mechanism of action of thiourea literature either.

    Foreign long thiourea as brightening agent and a grain refining agent used in electroplating copper fields. Nisit T-plated copper sulphate and other acidic thiourea added to the system, you can improve the coating hardness, but still below the polished uncoated substrate, and its surface dotted with small nodule-like projections, so that form a microscopic coating Roughness large gray film. Kang MS and other studies also show 41] thiourea can be added for controlling the surface roughness of the copper plating. Nikolic ND such as the use of thiourea as a brightener, were given a high degree of specular reflection can be done Cu and Zn plating layer. SuarezD F and other research also shows that increasing the concentration of thiourea in the bath can improve the coating smoothness. KaoY L other studies have shown a high concentration of thiourea is conducive not only to reduce the grain size, but also to increase the hardness of Cu plating. MuresanL team and Ke B et al study also shows that, by the addition of additives, including including thiourea in the bath can control the copper plating properties such as surface roughness and crystal orientation resistivity.

    The first study a lot, Liaoyi Jia found that the addition of thiourea in the plating bath can be masked Zn heavy metal impurities and increase the brightness of the coating; however, the added amount should be less than 5. O g / L, the general control of 0.5-1.0g / L range.shaogongzhang other studies indicate added 0.6 -0.8 g / L thiourea Au -Cu alloy plating solution, the hardness obtained under agitation 1.5 times higher than that of pure gold.jiaojiaoxu and other studies show that adding thiourea in nickel plating bath can increase the current density, the reason is thiourea molecules adsorbed on the crystal growth of active sites, effectively inhibited the crystal growth; additive prevents adsorption-desorption process the grain size becomes larger, but also to prevent the growth of a grain of priority, so that the deposition layer becomes flat.


    Thiourea as a way to secure the majority of the metal surface adsorption layer, in the relevant field plating has been widely used. E.g., plating pretreatment pickling or alkaline saved inhibitor, corrosion inhibitor as thiourea, adsorption is not a simple chemical adsorption, but adsorbed electrochemical charge transfer between the particles and the adsorption electrode; unqualified Plating on areas other and so on. Thiourea only as electroplating and electroless plating grain refiner, al


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